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MRS1504T3G, NRVS1504T3G
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5
PACKAGE DIMENSIONS
SMB
CASE 403A?03
ISSUE J
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
b
D
c
L1
L
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.95 2.30 2.47 0.077
INCHES
A1
0.05 0.10 0.20 0.002
b
1.96 2.03 2.20 0.077
c
0.15 0.23 0.31 0.006
DD
3.30 3.56 3.95 0.130
E
4.06 4.32 4.60 0.160
L
0.76 1.02 1.60 0.030
0.091 0.097
0.004 0.008
0.080 0.087
0.009 0.012
0.140 0.156
0.170 0.181
0.040 0.063
NOM MAX
5.21 5.44 5.60 0.205
0.214 0.220
HE
0.51 REF
0.020 REF
L1
HE
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